Osstem is a diamond sponsor of the 2023 EAO congress

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EAO–DGI diamond sponsor Osstem Implant presents education opportunities in Berlin

As part of Osstem Implant’s participation at this year’s EAO congress, Dr Matthias Kaupe, a specialist in oral and maxillofacial surgery from Germany, will be demonstrating the advanatges of the company’s surgical kits in two hands-on courses. (Image: Osstem Implant)

Wed. 27. September 2023

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BERLIN, Germany: The joint meeting of the European Association for Osseointegration and German Association of Oral Implantology (EAO–DGI) kicks off tomorrow in the German capital. As a diamond sponsor of the event, international dental manufacturer Osstem Implant will be showcasing its products and presenting a lecture and two hands-on courses, underlining its commitment to developing dental implantology and the entire field of dentistry worldwide.

In an industry forum at the congress, Osstem will offer delegates the opportunity to learn from experts how innovations from the industry have helped them in daily clinical practice. Tomorrow at 10 a.m., Dr Marco Tallarico, president of the Italian section of the Osstem Implant Scientific Community; Dr Matthias Kaupe, a specialist in oral and maxillofacial surgery from Germany; and Italian prosthodontist Dr Andrea Ricci will share their experiences in a presentation titled “Together has no limits—when innovation meets experience”. The session will be moderated by Dr Theodor Thiele, a well-known specialist in oral surgery, implantology and periodontics.

On 29 September at 9 a.m., meeting participants are invited to join the hands-on course on Osstem’s Crestal Approach Sinus Kit, which was specifically developed for minimally invasive internal sinus lift through a crestal approach, and the company’s Lateral Approach Sinus Kit, which allows safe lifting of the Schneiderian membrane through lateral access. The interactive session will be held in German by Dr Kaupe. At 2 p.m., he will be giving a hands-on course in German on Osstem’s Taper Kit, which is optimised for conical implants and easy placement of bone-level implants with diameters of 3.5–5.0 mm.

Osstem’s booth (#C25) can be found on Level 2 of the exhibition. Product managers will demonstrate how to use Osstem’s various products and present the newest innovations in implant and guided bone regeneration products. Participants can enjoy a welcome drink while learning from Osstem’s representatives.

More information about the congress and registration for the lecture and hands-on courses can be found at congress.eao.org.

 

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